NXP Semiconductors
NUP1301
Ultra low capacitance ESD protection array
001aaa631
120
I PP
(%)
80
100 % I PP ; 8 μ s
e ? t
001aaa630
I PP
100 %
90 %
5 0 % I PP ; 20 μ s
40
10 %
0
0
10
20
30
t ( μ s)
40
t r = 0.7 ns to 1 ns
30 ns
60 ns
t
Fig 1.
8/20 μ s pulse waveform according to
IEC 61000-4-5
Fig 2.
ESD pulse waveform according to
IEC 61000-4-2
6. Thermal characteristics
Table 8.
Thermal characteristics
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Per device
R th(j-a)
thermal resistance from
in free air
[1][2]
-
-
500
K/W
junction to ambient
R th(j-sp)
thermal resistance from
-
-
360
K/W
junction to solder point
NUP1301_1
[1]
[2]
Single diode loaded.
Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
? NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 01 — 11 May 2009
4 of 13
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